Megatrends to Roadmaps to Standards: PHM and Reliability
Motivation and Background:
Megatrends in Reliability include every Electrical Engineering and Computer Science
discipline,
e.g. energy,
semiconductors, communications, transportation, software. Summing this up, a Reliability Roadmap
will encompass all
aspects of Hardware and Software, introducing this to the IEEE Prognostics and Health Management
conference event is the
venue that will introduce this to a broad Reliability audience.
The Megatrends to Roadmaps are extremely useful in determining what existing and new industry
Reliability standards will
be useful as new products are developed or existing products are used in differing applications.
The speakers will describe Megatrends today, how Roadmaps intersect these Megatrends, and what might
be some of the
first components of a new Reliability Roadmap that will lead to the use of new or existing
standards.
The panelists would like to interact with the attendees and find out what they are doing in the
Reliability-PHM areas.
For example one area of concern is:
The Semiconductor PHM and Reliability associated with the decreasing feature size, three D
integration and the ever
increasing product thermal load. For example, when new base stations or CPU racks are upgraded with
the latest
semiconductor node, the install footprint remains unchanged, this tends to place a new thermal
operating point, and we
know for every ten degrees rise in temperature the metal system Reliability degrades significantly,
ultimately something
that needs to be considered when establishing a PHM program. The typical bathtub use curve is
becoming more and more
constrained, sometimes PHM and wear out has to be factored in as shown below: